2024 年 2 月 15 日，射頻、微波和毫米波設備高頻和高功率半導體封裝設計、生產和組裝領域的領導者StratEdge Corporation宣布其具有制造混合封裝的能力，用于難以或不可能重新設計的傳統應用。這些混合封裝通常是幾十年前開發的，在許多關鍵的國防應用中仍然至關重要。

?

?

StratEdge 擅長生產帶有密封饋通的大型金屬外殼所需的玻璃與金屬、陶瓷與金屬和金屬與金屬密封技術。與模壓陶瓷封裝類似，ASTM F15 合金是構建混合封裝的關鍵成分。StratEdge 擁有多臺各種氣體氣氛的爐子，用于玻璃密封以及釬焊或釬焊各種成分的組件，包括金屬化陶瓷、鐵合金、銅、銅復合材料和銅層壓板。

?

StratEdge 全球銷售副總裁 Casey Krawiec 表示："StratEdge 擁有獨特的設備和專業知識，可以制造這些類型的封裝，制造模壓陶瓷封裝的工藝與制造軍事和航天應用中使用的傳統混合封裝的要求有許多相似之處。"

?

英文稿原文：

Santee, Calif. – 15 February 2024 –?StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, announces its capabilities for making hybrid packages used in legacy applications where redesigns are difficult or impossible.? These hybrid packages, often developed decades ago, are still vital in many critical defense applications.

StratEdge excels at glass-to-metal, ceramic-to-metal, and metal-to-metal sealing technologies necessary for the production of large metal housing with hermetic feedthroughs. Similar to its molded ceramic packages, ASTM F15 alloy is a key component used in constructing hybrid packages. StratEdge possesses numerous furnaces with various gas atmospheres that are required for glass sealing and brazing or soldering components of various compositions including metalized ceramic, iron alloys, copper, copper composites, and copper laminates.

"StratEdge has the unique equipment and expertise required to build these types of packages,"?says Casey Krawiec, VP of Global Sales for StratEdge. Krawiec further explained, "Our processes for manufacturing molded ceramic packages share many similarities with the requirements for building legacy hybrid packages used in military and space applications."

長按識別二維碼關注公眾號，點擊下方菜單欄左側“微信群”，申請加入交流群。